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SENSOR DESIGN ASSOCIATION has the engineering talent, equipment and processes in place to support all wafer probe services, including test software development, probe card design/fabrication, debug and production probing.

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Experience with all probe card technologies including:

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  • Cantilever: 1- 16 sites up to 800 probes

  • Vertical: Multi site up to 64 sites

  • Membrane: Multi site

  • RF: Coax, Membrane and Custom solutions

  • Elevated probing up to 135°C and custom probing up to 180°C

  • Bumped wafer probe


 

Wafer probe data analysis throughout your startup and ongoing production probe:

 

  • Wafer Map Conversion

  • Retest of defined bins without full wafer reprobe

  •     Custom mapping for inkless assembly

  •     Onsite custom format solutions for inkless assembly

  •     Assembly back to production map conversion

  •     Wafer inspection map conversion to electrical test maps 

  • Wafer Analysis

  •     Composite Mapping

  •     Multi site comparison

  •     Integration to Galaxy® software



Summary of Probe Capabilities:

 

  • 3” to 12” capability

  • Probe card design, fab and verification

  • Bumped probe

  • Al, Au pads and Pb, Pb free bumps

  • High Z force chuck

  • High pin count, fine pitch

  • Multi site

  • Vertical, Cantilever & Membrane probe

  • RF probe (Membrane, Coax or custom solutions)

  • N2 and vacuum wafer storage

  • Elevated probing up to 180°C

  • Data analysis capability

  • High volume production probe

  • Handle wafer back grind to 6 mils

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