SENSOR DESIGN ASSOCIATION has the engineering talent, equipment and processes in place to support all wafer probe services, including test software development, probe card design/fabrication, debug and production probing.
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Experience with all probe card technologies including:
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Cantilever: 1- 16 sites up to 800 probes
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Vertical: Multi site up to 64 sites
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Membrane: Multi site
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RF: Coax, Membrane and Custom solutions
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Elevated probing up to 135°C and custom probing up to 180°C
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Bumped wafer probe
Wafer probe data analysis throughout your startup and ongoing production probe:
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Wafer Map Conversion
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Retest of defined bins without full wafer reprobe
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Custom mapping for inkless assembly
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Onsite custom format solutions for inkless assembly
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Assembly back to production map conversion
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Wafer inspection map conversion to electrical test maps
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Wafer Analysis
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Composite Mapping
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Multi site comparison
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Integration to Galaxy® software
Summary of Probe Capabilities:
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3” to 12” capability
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Probe card design, fab and verification
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Bumped probe
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Al, Au pads and Pb, Pb free bumps
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High Z force chuck
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High pin count, fine pitch
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Multi site
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Vertical, Cantilever & Membrane probe
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RF probe (Membrane, Coax or custom solutions)
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N2 and vacuum wafer storage
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Elevated probing up to 180°C
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Data analysis capability
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High volume production probe
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Handle wafer back grind to 6 mils